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SECE Welcomes Delegation from the Malaysia Semiconductor IC Design Park

time:2026-09-08 11:17autor:click:

On the morning of September 4, a delegation from the Malaysia Semiconductor IC Design Park visited the School of Electronic and Computer Engineering (SECE), Peking University Shenzhen Graduate School, for discussions on talent development, research collaboration, and industry engagement in the fields of integrated circuits and artificial intelligence. Du Boqiang from the Office of Research Affairs and Gao Sheng from the Office of Academic Affairs of Peking University Shenzhen Graduate School, Professor Wang Ronggang, Associate Dean of SECE, Jiao Hailong, Assistant Dean and Tenured Associate Professor of SECE, and administrative staff members of the School attended the meeting. Professor Dan Hao, Associate Dean of SECE, joined the meeting online.   

 

   

Figure 1. Discussion between representatives from both sides


Professor Wang Ronggang, Associate Dean of SECE, welcomed the delegation. He noted that SECE has long been committed to talent development and research innovation at the forefront of information technology, with strong research foundations in integrated circuits, artificial intelligence, computer science, and related fields. In recent years, the School has continued to advance international engagement and industry–academia collaboration. He expressed the hope that the visit would provide an opportunity to further strengthen communication with Malaysian institutions in talent development, research collaboration, and industry engagement, while exploring more practical and sustainable mechanisms for future cooperation.


                           

Figure 2. Professor Wang Ronggang delivers welcome remarks


Du Boqiang from the Office of Research Affairs introduced the overall development and research landscape of Peking University Shenzhen Graduate School.


                           

Figure 3. Du Boqiang introduces PKU Shenzhen


Jiao Hailong, Assistant Dean and Tenured Associate Professor of SECE, introduced the School’s academic disciplines, talent development, research platforms, and major research areas.

                           

Figure 4. Jiao Hailong introduces SECE


                           

Figure 5. Yong Kai Ping introduces the Malaysia Semiconductor IC Design Park


Yong Kai Ping, Chief Executive Officer of the Selangor Information Technology and Digital Economy Corporation (Sidec) and a member of the Malaysian delegation, introduced the Malaysia Semiconductor IC Design Park, including its initiatives in talent development and industry growth. He also shared perspectives on Malaysia’s semiconductor ecosystem, demand for specialized talent, and opportunities for international collaboration.


During the discussion session, the two sides exchanged views on talent development in semiconductors and artificial intelligence, short-term specialized training programmes, faculty and student exchanges, student research opportunities, and talent recruitment and development. They also discussed potential collaboration in joint research, industry partnerships, resource coordination, and technology commercialization. Both sides expressed their interest in further identifying areas of mutual interest and exploring concrete collaborative projects by drawing on their respective strengths in research, education, and industry resources.


                           

Figure 6. Delegation visits the Guangdong Provincial Key Laboratory of Computing-in-Memory Chips


Following the meeting, the delegation visited the Guangdong Provincial Key Laboratory of Computing-in-Memory Chips. Jiao Hailong introduced the research background, technological approaches, and potential applications of computing-in-memory chips.


                           

Figure 7. Group photo of representatives from both sides

The visit further enhanced mutual understanding between SECE and semiconductor-related institutions in Selangor, Malaysia, and laid a foundation for deeper exchanges and cooperation in talent development, research collaboration, and industry engagement.